(China (Mainland))
Product Summary
The XC3S400-4FTG256 Field-Programmable Gate Array is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The XC3S400-4FTG256 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Parametrics
XC3S400-4FTG256 maximum ratings: (1)Internal supply voltage: -0.5 to 1.32V; (2)Auxiliary supply voltage: -0.5 to 3V; (3)Output driver supply voltage: –0.5 to 3.75 V; (4)Input reference voltage: –0.5 to VCCO+0.5 V; (5)Junction temperature: VCCO < 3.0V, 125 ℃; VCCO > 3.0V, 105 ℃; (6)Soldering temperature: 220 max ℃; (7)Storage temperature: –65 to 150 ℃.
Features
XC3S400-4FTG256 features: (1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Logic resources; (4)Digital Clock Manager (up to four DCMs); (5)Eight global clock lines and abundant routing; (6)Fully supported by Xilinx ISE development system; (7)MicroBlaze processor, PCI, and other cores.
Diagrams
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 XC3S400-4FTG256C |
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IC SPARTAN-3 FPGA 400K 256-FTBGA |
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XC3S400-4FTG256I |
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SPARTAN3A FPGA 400K STD 256FTBGA |
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