XC3S400-4FTG256I

Product Summary

The Spartan 3 Field-Programmable Gate Array XC3S400-4FTG256I is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to five million system gates. The XC3S400-4FTG256I builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from state-of-the-art Virtex technology. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S400-4FTG256I absolute maximum ratings: (1)VCCINT Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO Output driver supply voltage: –0.5 to 3.75 V; (4)VREF Input reference voltage: –0.5 to VCCO+0.5 V; (5)VIN Voltage applied to all User I/O pins and Dual-Purpose pins: –0.5 to VCCO+0.5 V; (6)Voltage applied to all Dedicated pins: –0.5 to VCCAUX+0.5 V; (7)TJ Junction temperature at VCCO < 3.0V: 125 ℃; VCCO > 3.0V: 105 ℃; (8)TSOL Soldering temperature: 220 ℃; (9)TSTG Storage temperature: –65 to 150 ℃.

Features

XC3S400-4FTG256I features: (1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Densities as high as 74,880 logic cells; (4)326 MHz system clock rate; (5)Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V); (6)Up to 784 I/O pins; (7)622 Mb/s data transfer rate per I/O; (8)Seventeen single-ended signal standards; (9)Seven differential signal standards including LVDS; (10)Termination by Digitally Controlled Impedance; (11)Signal swing ranging from 1.14V to 3.45V; (12)Double Data Rate (DDR) support; (13)Abundant logic cells with shift register capability; (14)Wide multiplexers; (15)Fast look-ahead carry logic; (16)Dedicated 18 x 18 multipliers; (17)JTAG logic compatible with IEEE 1149.1/1532 specifications; (18)Up to 1,872 Kbits of total block RAM; (19)Up to 520 Kbits of total distributed RAM; (20)Clock skew elimination; (21)Frequency synthesis; (22)High resolution phase shifting; (23)Synthesis, mapping, placement and routing; (24)MicroBlaze processor, PCI, and other cores.

Diagrams